Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material: Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil: Ed/ra
Min. Line width: 2 mil
Min. Line spacing: 2 mil
Min. Hole size: 0.2mm
Max. Board size: 800x400mm
Min. Board thickness: 0.1mm
Min. Solder mask thickness: 10um
Solder mask types: Green, yellow, black, white, blue, red and clear
Profiling: Punching, routing, v-cut
Soldering thermal resistance: 300°c/10 seconds
Peeling strength: =1.4kg/cm
Surface resistance: 105mo
Insulation resistance: 105mo
Dielectric strength: 9.8x105v/cm
Flammability: Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, Double-sided, Multi-layers (max 28 layers) and
Rigid-flexible PCB, Aluminium board
Surface Finishing:
HASL(LF), Gold plating, Electroless nickel immersion gold,
Immersion Tin, OSP(Entek)
Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4
Copper Foil:ED/RA
Min. Line Width:2 mil
Min. Line Spacing:2 mil
Min. Hole Size:0.2mm
Max. Board Size:800x400mm
Min. Board Thickness:0.1mm
Min. Solder Mask Thickness:10um
Solder Mask Types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, Routing, V-cut
Soldering Thermal Resistance:300°C/10 seconds
Peeling Strength:=1.4kg/cm
Surface Resistance:105mO
Insulation Resistance:105mO
Dielectric Strength:9.8x105v/cm
Flammability:UL-94V-0
Performance Test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
Types:
Single-sided, double-sided, multi-layers (max 28 layers) and
Rigid-flexible pcb, aluminium board
Surface finishing:
Hasl(lf), gold plating, electroless nickel immersion gold,
Immersion tin, osp(entek)
Base material:Polyimide(kapton), polyester(pet), aluminium, fr4
Copper foil:Ed/ra
Min. Line width:2 mil
Min. Line spacing:2 mil
Min. Hole size:0.2mm
Max. Board size:800x400mm
Min. Board thickness:0.1mm
Min. Solder mask thickness:10um
Solder mask types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, routing, v-cut
Soldering thermal resistance:300°c/10 seconds
Peeling strength:=1.4kg/cm
Surface resistance:105mo
Insulation resistance:105mo
Dielectric strength:9.8x105v/cm
Flammability:Ul-94v-0
Performance test:
100% electrical and electricity performance test
