Layer:1-50/material:FR4,PTFE,Rogers/Board thickness:0.2-10mm/min hole diameter 0.15mm/Min line wideth&space2&2mil/Aspect ratio:32:1/size:50X50mm--609X1200mm/copper thinckness:HOZ-10OZ/surfce finishing: ENIG,I-S,I-Tin,Panel Gold plating,Hard gold plating,Soft gold,HASL,Lead free HASL,OSP,ENPIG/others:back drill,special technology
Fast delivery single&double side led pcb, aluminum pcb for variety of power led.
FR4 High Tg 34 layer ATE,Burn-in IC or semiconductor test PCB:
Thickness 4.8mm,min hole diameter:0.15mm,Aspect ratio:32:1,size:440*440mm,surface finishing:panel gold plating+hard gold plating,min hole wall to conductor:4.8mil, via hole:vacuum resin plugging
