Material: FR-4
Minimum wire spacing: 0.10mm
Minimum drilling diameter: ||¨¬0.20mm
Thicknesses: 0.16
Thickness: 0.8 to 3.0mm
Hole size: 0.1mm (4-mil) (minimum)
Line width/space: 0.1mm (4-mil) (minimum)
Surface treatment: hasl/ hasl lead-free, lf-hasl, hal, chemical tin, chemical gold, immersion: silver/gold, osp, gold plating
High tg and frequency
Twist and warp: <1% p="">
0.1mm on integrated circuit parts with so, sop, soj, tssop, qfp and bga
Smt: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
Dip pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside
Inspection online for aoi and ict test
X-ray inspection for bga
High-precision e-testing includes ict inline, function test, full experienced qc and qa engineer
With rohs directive-compliant
Packaging safety
