1. High Temperature & High Frequency Resistant Circuit Base Material
1) Polyimide woven glass fibre copper clad laminate
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in the environment which request long life usage under the high temperature. For example, high temperature & high frequency resistant circuit boards in many electric equipments of Airplane engine instrument, Pit Drilling, Auto-control equipment and MULLER.
Specification: 625mm¡Á1040mm, 1040mm¡Á1250mm£¨41 inch¡Á49 inch£©
Thickness: 0.1mm¡«6.0mm
Copper foil thickness£º0.018¡«0.105mm
2) Polyimide woven glass fibre insulation laminated board
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in making special high temperature & high frequency resistant insulation board such as Dry type transformer, Special Motor and Radio & TV Transmitter.
Specification: 625mm¡Á1040mm, 1040mm¡Á1250mm£¨41 inch¡Á49 inch£©
Thickness: 0.1mm¡«65mm
2. Microwave Circuit Base Material
1) PTFE woven glass fibre copper clad laminate
Performance: Little breakage and Steady dielectric constant. This product has a good electrical properties and high machining performance.
Usage: It is widely used in Moving Communication, Radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Specification: 500¡Á500mm
Thickness: 0.1 - 6.35mm
Copper foil Thickness: 0.018mm - 0.105mm¡£
2) Polyphenylene oxide woven glass fibre copper clad laminate
Permittivity: 3.2+0.1
Performance: Little breakage and Steady dielectric constant.
High temperature resistant is ¡Ý150¡æ. This product has a high machining performance. The Machining technics of the printed circuit board is the same as the traditional FR-4.
Usage: It is widely used in Satellite communication, Solid-state phased-array radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Specification: 625¡Á1040mm
Thickness£º0.1-6.0mm
Copper foil Thickness£º0.018-0.070mm
3) Polyphenylene oxide woven glass fibre insulation laminated board
Permittivity: 3.2+0.1
Performance: Little breakage and Steady dielectric constant.
Usage: It is used in making Si-B-O-N material.
Specification: 625¡Á1040mm
Thickness£º0.1-60mm
3. Ultra Thick Copper Clad Laminate
Performance: Best electrical properties. It can be afford high power electric current. The peel strength of the copper foil can be arrived over 3N/mm.
Usage: It is used in making electricity, automobile electronic products and high power electronic equipment circuit base material.
Specification: 510¡Á610 mm; 625¡Á1000mm; 1040¡Á1250mm
Copper Clad Laminate Thickness: 0.15¡ª5.0mm;
Insulation Laminated Board Thickness£º0.10--60mm.
4. Metal Base Copper Clad Laminate
1) Copper base copper clad laminate
2) Aluminum base copper clad laminate
3) Iron base copper clad laminate
