1. High Performance CW Arc Lamps (Kr lamps) 2. High Performance Pulse Flashlamps (Xe lamps) 3. IPL Lamps.
For OEM users or laser integrators, we can provide you with a range of high performance components and sub-assemblies at more attractive prices. The OEM pulsed laser consists of a laser head (pump chamber, Nd:YAG rod, lamp, laser resonator, optional aperture and optional beam expander), a lamp driver (power supply) and an optional chiller. These lasers can be used for laser welding and cutting. 55KG vary for different model.
355nm, 532nm, 1064nm, 10.6um f-theta lens. Portable size.
STSL scanner lenses specially designed and optimized for use in CO2 laser 2-axis galvo-scanner systems with full beam diameters of up to 15.0mm. Mirror sets appropriate for use with beam diameters up to 15mm require an increase in mirror separation in comparison with smaller mirrors. These changed optical conditions are catered-for by the STSL series. These single-element lenses are designed to represent the best achievable compromise for on-axis and off-axis aberrations, field flatness and F-theta characteristics, obtainable using single-element spherical-surface designs of (standard) 48mm diameter and 3mm edge thickness. The lens material is ZnSe. 48mm lens diameter.
Gooch & Housego products. There are following Q-switches in stock and they can be immediately delivered: QS27-6.5C-B, QS27-5S-B, QS27-5C-B, QS27-4C-B, QS27-4S-B, QS27-4S-S, QS27-3C-S, QS27-3S-S and Stallion series Q-switches. Portable size.
Laser cutting (84561000)
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Laser Type:Q-switched Nd:YAG Laser Wavelength:1064nm/532nm Output:200mj400mj600mj Pulse Duration:
4000*2000*20mm
