Material: Aluminum Bases Layer/Thickness: 2L/1.6 mm Copper Thickness:1 OZ Surface treatment:ENIG Min Line Width: 0.13mm Min Line Space: 0.12mm Min Hole:0.32mm Solder Mask:White Technical featuer: special materials Application Field: High frequency amplifier
Layer NO# 1 or 2Layers Material: Aluminum 0.80~3.80W/m.k Finished Thickness: 1mm or 1.6mm Outer Copper: 1 ~3 OZ Surface treatment: HASL LF / OSP / ENIG
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Product type 2 Layer Metal Base PCB Material Copper base Layers/thickness : 2L/1.6mm Line Space/width : 25/30mil Surface treatment : ENIG Minimum hole dia. 2.5mm Outer Layer Copper Thickness 1/1 OZ
Thermoelectric Separation Copper Based PCB Layers: 1 Thickness: 3mm Cu PCB for high power LED light Substrate material: Red Copper Copper thickness: 1 Oz Plating process: Immersion gold Description: Power LED MCPCB Countersink holes
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Type: Double sides printed wiring board Laminate: FR4 TG170 Board size and thickness: 100*36*1.60mm*3UP Surface finished: ENIG Copper thickness: 35um Solder mask : Green Silkscreen : White
FR4 material, 0.2mm thickness pcb, thin pcb, ENIG pcb, 94v0 pcb material: FR4, copper finished: 1/1 OZ finished thickness: 0.2mm surface finished: immersion gold (Au 2Uâ??) min hole: 0.25mm solder mask: green
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added
