PCB
What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication
Multilayer and 2rd HDI PCB 35
HDI Wholesale PCB Board, HDI PCB Board, Single-Side, Double-Side PCB, PCB Process, High Frequency Board, Customized PCB Product Type: HDI Application Field: Industril Control, Medical, Communication Layer/Board thickness: 10L/1.1mm Suface Finish: ENIG Trace/Space: 3/3mil Smallest Hole Diameter: 0.1MM Technical Feature: Three Orders Overlap Hole, Tiny Line, Micro Vias As a PCB board supplier, we can OEM PCB including HDI PCB board, single-side PCB, double-side PCB, PCB process, high frequency board.
Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm) 0.075 High Density Interconnector Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
Rigid-Flex PCB,FPC,PCB, PRINT CIRCUITS BOARD
HDI Board HDI PCB Specification layer Count 12L Material ISOLA Board Thickness 2.4±0.1mm Stack-up 4+N +4 Aspect Ratio 12:1, 8mils Hole to Copper Blind vias L1L4 , L8L12 Micro-vias L1L2 , L11L12 Via-in-Pad Min. LW/LS 0.075mm Surface Finish ENIG We have over 17 years experience of HDI PCB baord production, and provide high quality HDI board to customers is our long term strategy, Any HDI Board projects need production please contact us freely
