Supplier: Gift & premium, time piece, electronics, leather & textile apparel, ceramic, bags, umbrella, beach chair
Services: OEM/ODM project
1.Introduction The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system. 2. Features Excellent beam quality and system reliability High-speed scribing (up to 120 mm/s), very low-defective index Auto cooling system Precise CNC worktable Friendly man-machine interface and simple software operation 3. Technical Parameters Laser medium Nd3+:YAG Wavelength 1064 nm Pump source Kr lamp Laser cavity Ceramic Modulated frequency 0.5 - 50 kHz Beam power Adjustable, max 50 W Aiming laser Red Scribing speed Adjustable, max 120 mm/ s Scribing depth Max 1.2mm Line width Min 0.2mm Worktable repeating accuracy 0.01mm Marking area 300 mm í- 300 mm Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) Input power Max 5kW Dimension 550 mm x 290 mm x 650 mm Net weight ~560 kg Cooling Mode Water cooling 4.Standard Configuration Laser machine í- 1 set Exhauster í- 1 set Vacuum pump í- 1 set Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set Worktable unit (CNC controller) í- 1 set Kr lamp í- 2 pieces Laser detector í- 1 piece PC í- 1 set Scribing software (In English) í- 1 set Operation manual (In English) í- 1 Wooden Case
Performance Features 1) Taking YAG lamp-pumped solid laser device as the light source,2D fast-speed scanning lences is swing as the scheduled angles under the controling of the computer . The laser focus on the surface of the work piece by F-úclences to form images and realise marking and graph processing. 2)CO2 Laser Marking Machine has the advantages of high-rate power transfer, the good quality beam, longtime working lifespan and exempt-maintenance, etc. 3) Using fast-speed scan lens, it can scan the graph in shortest time & finish fine marking process. 4) Users can request automatic configuration fixture, Baiting production line 5) User can mark data, series number & bar code automatically. 6) User can share & communicate the data with other equipments and online. Application Scope and material It is used in the fields of excipients clothing, medicine, packaging, building ceramics, beverage packaging, tobacco packaging, food packaging, cutting fabric, rubber, casing nameplate, technology gifts, electronic components, leather and other industries. Technical data Laser output power:30W Standard marking scrope:110 mmí110mm Selective Marking scope: 70mmí70mm/175 mmí175mm Marking depth: 0.01~0.3m Marking speed:
Description- The UV Laser Marking with its wavelength 355nm is suitable for marking plastics (ABS, PA) due to a high repetition rate. The UV laser wavelength is suitable and versatile in marking a wide range of materials and is perfect for â??cold markingâ?? applications where heat zones are not allowed. UV Laser mark at very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers they are most suitable for fine marking and structuring without thermal impact on glass applications and/or ceramics. The UV laser marking will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of micro fracture. The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications. They also provide an excellent quality for classical laser marking applications and micro material processing. Features- Small beam diameter and fine marking line Good quality and high laser beam stability Complete machine stability, simple and easy operation Narrow pulse width, small heat affected zone, work-piece without damage Suitable for sensitive material as cold light source Laser directly acting on molecular chain with maximum extend to avoid thermal effect It works stably, applied in superbly precise marking, such as: LCD, wafer, chip ceramic, sapphire, precise surface marking of other materials,3C electronics, Lamps, food package, wire rod ,leather, ceramic, PCV, glass, Phone case, medicine bottle, fine marking on glass substrate, electric appliance marking and so on. Technical Specifications- Wavelength 335nm Laser Beam Mode TEM00 Average Power Up to 2W Positioning Visible Red Diode Light Input Power 115/230VAC 50/60Hz System Power Consumption < 950W Cooling Air Cooled, active thermo-electric/Water Cooled Operating Temperature Range 18 to 35C (64 to 95F) Humidity 10% to 85% Non-condensing STANDARD LENS CONFIGURATIONS FOCAL LENGTH 100 mm 65 mm X 65 mm (2.56 X 2.56) 160 mm 110 mm X 110 mm (4.33 X 4.33) 255 mm 175 mm X 175 mm (6.89 X 6.89)
