IC (Integrated Circuits).
Integrated circuits (IC).
CYPRESS produce a series of RAM, ROM, I / O control circuit. Product Application: Clock and buffer, control communications, framers and mappers, image sensors, storage, network processing, optical sensors, PSoC mixed-signal controller, physical layer devices, programmable logic, solar cells, universal serial bus Wireless.
Supplier: Semiconductors, electronic components
Buyer: Semiconductors, electronic components
Supplier: Semiconductor components, Relay
Supplier: Electronic components, semiconductor
Buyer: Electronic components, semiconductor
Supplier: Semiconductor, electronic components
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Although the Intel EP80579 branding will be new to most of you, the underlying technology is comprised of products that have a well established history at Intel. In fact, this line of products is based on the Pentium M processor core, as it has been in development for quite some time now. The Intel EP80579 Integrated Processor family, however, is more than just a new processor. The products actually consist of new System on a Chip designs that integrate a Pentium M core, with a Memory Controller Hub (MCH), I/O hub (ICH), and in some cases specialized security, TDM (Time Division Multiplexing for voice-over-IP apps), and data path acceleration engines, which have been dubbed Intel QuickAssist Technology. Development was started on the Intel EP80579 Integrated Processor family to prepare the company for the impending onslaught of smart, Internet-connected devices and appliances predicted to arrive over the next few years. The Intel EP80579 product line puts Intel in a position to target several growth areas across Consumer Electronics (CE), Mobile Internet Devices (MIDs) and other embedded markets. "We’re now able to deliver more highly integrated products ranging from industrial robotics and in-car infotainment systems to set-top boxes, MIDs and other devices. By designing more complex systems onto smaller chips, Intel will scale the performance, functionality and software compatibility of IA while controlling the overall power, cost and size requirements to better meet respective market needs,” said Gadi Singer. The individual components within the Intel EP80579 SoCs communicate over an internal Front Side Bus that connects the Processor Core, MCH, and ICH. And Intel has also developed a high performance bus to connect the security, TDM, and data path acceleration engines to the I/O Complex. Please note, that only four of the initial eight products being announced today feature the Acceleration Services Unit and TDM interface represented in the block diagram above. Those features are what make up the Intel QuickAssist Technology, which isn't featured on every Intel EP80579 SoC. Hope this article could give you a little help.
Manufacturer Part#: NU80579EZ600CT Product Category:IC Chips Manufacturer:Intel Description:SOC EP80579 1088-Pin FCBGA NU80579EZ600CT Datasheet Package:BGA Quantity:3100 PCS Lead Free Status / RoHS Status:Lead free / RoHS Compliant Moisture Sensitivity Level(MSL):3(168 Hours) Specifications Manufacturer:Intel Product Category:IC Chips Type:System-On-Chip Mounting:Surface Mount Program-Memory-Type:ROMLess Ethernet:3 USB:2 Maximum-Speed-MHz:600 Processing-Unit:Microprocessor Number-of-Programmable-I-Os:36 Minimum-Operating-Temperature-°C:-40 Maximum-Operating-Temperature-°C:85 Interface-Type:CAN/Ethernet/I2C/SPI/UART/USB SPI:1 I2C:2 I2S:0 UART:2 USART:0 CAN:2 Programmability:No Temperature-Grade:Industrial PCB-changed:1088 Standard-Package-Name:BGA Supplier-Package:FCBGA Pin-Count:1088 Lead-Shape:Ball Maximum-Clock-Rate-MHz:600
