Green laser pointer Glp0002 green laser pointer Specification Battery:2pcs*"aaa" Laser type:visible laser diode Wave length :532nm Output power:5mw, 10mw, 20mw Deam distance :1500-5000meter Body size:160mm(l) x 14mm(dia) Body material: brass Shell color: black, silver, black&white
1.Which laser flashlight straight style appearance, non-slip surface pattern broken home, feel full pull the wind. 2.8000m super 5000mw laser pointer , bright beam and the distance 3.Aerospace aluminum shell material and a built-in cooling unit, very durable Http://www.Htpow.Com/green-5000mw-laser-pointer-cheap-htpow-high-power-green-laser-pointers-starry-5-in-1-focus-adjustable-p-1004.Html 5000mw laser pointer green features: Material& ìooaluminum aviation Representation finish:silver coating, feel Switch mode:tap Battery 1 * 18650 Wavelength: 532nm Performance:5000mw Reach:500-10000 (higher performance, greater range) Working voltage:dc3v Working temperature:0-35 degrees Weight:57g (without batteries)
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Buyer: Laser modules
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Laser cutting (84561000)
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Green laser beam emission Wavelength: 532nm 2pcs AA size battery included Output: 5mW, 10mW, 20mW, 30mW, 50mW, 100mW, 150mW, 200mW Facula size: smallestí_ª¦1.0mmú¼15mí_ª¦18mm Laser range: 500 to 10,000meter (up to power output) Used as indicator, teaching baton Gift box for packaging, for more details, please visit www.henbo168.com.cn http://henbo.diytrade.com
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
