Aluminum Nitrides (AlN) combine high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications. Advantages High thermal conductivity.Thermal stability up to at least 1800°C Excellent insulation High hardness High compressive strength High accuracy Good wear-resistance Well resistant to high temperature Non-absorbent Favorable mechanical characteristics extending into the high-temperature range. Low thermal expansion and resistance to thermal shock. Special optical and acoustic characteristics. Unusually high thermal conductivity combined with good electrical insulation characteristics. Exceptional stability when exposed to many molten salts. Offer different specification and dimensions according to your request High thermal conductivity AlN ceramic Properties Flexural strength is 300 ± 5MPa Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C) Thermal conductivity is 100-200 Wm-1K-1 Insulation resistance is >1012Ωcm (20°C) Supply different purity products such as 95%Al2O3, 98%Al2O3, 99%Al2O3, 99.5%Al2O3 Ceramic materials. Alumina ceramic products, including tubes, rods, crucibles, plates, and other parts by your drawing. Silicon carbide ceramic products, including beams, plates, tubes, crucibles etc. Boron nitride ceramic products, including plates, the crucible, and other parts as you need. Application 1. Aluminum nitride powder with high purity, small size, high activity, is the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate. 2. AlN ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high-temperature resistance, chemical corrosion resistance, high resistivity, dielectric loss is small, think of the large scale integrated circuit substrate and packaging materials. 3. More than the traditional aluminum nitride alumina, high hardness, abrasion-resistant ceramic materials is new, but because of its high cost, only for the serious wear of the parts. 4. High melt erosion and thermal shock resistance of AIN ceramics by heat, can be made of GaAs crystal crucible, Al evaporation dish, magnetic fluid generating device and the high-temperature corrosion of turbine components, using the optical properties for the infrared window. Aluminum nitride thin film can be made of the high-frequency piezoelectric element, ultra large scale integrated circuit substrate. 5.Aluminum nitride, heat resistance, erosion resistance of the molten metal, but the acid stability in alkaline solution Easy to be eroded.AIN new surface is exposed to moist air will react very thin oxide film. Using this characteristic can be used like aluminum, copper, silver, lead and other chemical properties of metal crucible for metal melting and casting mould of.AIN ceramics is better, can replace toxic beryllium oxide ceramics are widely used in the electric industry.
BN Boron Nitride is often referred to as white graphite because it has a microstructure similar to that of graphite. However, unlike graphite, boron nitride is an excellent electrical insulator that has a higher oxidation temperature. It offers high thermal conductivity and good thermal shock resistance and can be easily machined to close tolerances in virtually any shape. After machining, it is ready for use without additional heat treating or firing operations. In inert and reducing atmospheres, BN will withstand temperatures over 2,000°C. It is commonly used as an insulator in contact with tungsten and graphite electrodes at those temperatures. All Boron Nitride grades can be used in oxidizing atmospheres up to 750°C. It is not wet by most molten metals and slags and can be used in contact with most molten metals including aluminum, sodium, lithium, silicon, boron, tin, germanium, and copper. Boron Nitride is available in a variety of solid grades, differentiated by binder and composite: BN-2000, BN-2300, BN-2800, BN-3000...
Hexagonal Boron Nitride has the same type of layer structure as graphite and provides a very good lubrication/mold-release characteristic. BN is stable up to approximately 2000°C in the inert atmosphere.Besides, Boron Nitride is stable against most organic solvents and corrosive chemicals, and unwettable by most molten metals and glasses. Boron Nitride has high electrical insulation and voltage resistance at high temperature and no changes in permittivity and dielectric loss up to high-frequency area. As for its lubricity and mold-release efficiency, friction coefficient of Boron Nitride does not change up to considerably high temperature in nitrogen atomosphere, which enables use up to approximately 950°C in the air. What's more, because of high thermal conductivity and high heat radiation, BN can be applied to various kind of heat radiators.
Si3N4 Ceramic Substrate Manufacturer,Silicon Nitride Ceramic For IGBT,Power Module Substrates,LED Substrate Product Description Silicon Nitrides (Si3N4) Feature An Excellent Combination Of Material Properties. They Are Nearly As Light As Silicon Carbide (SiC), But Their Microstructure Gives Them Excellent Thermal Shock Resistance And Their High Fracture Toughness Makes Them Resistant To Impacts And Shocks. Properties Of Silicon Nitride (Si3N4) Very Low Density (3.21 G/Cm3) Very High Fracture Toughness (7 MPam1/2) Good Flexural Strength (850 MPa) Very Good Thermal Shock Resistance: High Thermal Stress Parameters (569 K) Maximum Operating Temperature In An Oxidizing Atmosphere: 1,300°C Maximum Operating Temperature In A Neutral Atmosphere: 1,600°C Feature High Strength (High Reliability) Similar To The Thermal Expansion Coefficient Of Semiconductors Such As Si, SiC, And GaN High Dielectric Strength High Bending Strength Main Use Of Precision Ceramics For Electronics (Si3N4=Silicon Nitride) Power Module Substrates LED Substrates Submount For Optical Pick-Up Heat Dissipation Substrates The porous silicon nitride ceramic material combines the excellent properties of both the silicon nitride ceramic and the porous ceramic and is a ceramic material having a communicating or closed pore in the body. Porous silicon nitride ceramics have been widely used in aerospace and environmental chemicals due to their special structure and properties, such as low density, high porosity, moderate dielectric properties, high specific surface area, high hardness, and high fracture toughness. Important fields such as biomedicine, national defense, and military.
Ceramic sputtering target Ceramic Sputtering Targets : Boride Sputtering Targets Cr2B,CrB,CrB2,Cr5B3, FeB,HfB2,LaB6,Mo2B,Mo2B5,NbB,NbB2,TaB,TaB2,TiB2,W2B,WB,VB,VB2,ZrB2 Carbide Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC,TiC,WC,W2C,VC,ZrC Fluoride Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3 Nitrides Sputtering Targets : AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Oxide Sputtering targets : Al2O3,Sb2O3,ATO,BaTiO3,Bi2O3,CeO2,CuO,Cr2O3 ,Dy2O3,Er2O3,Eu2O3,Gd2O3,Ga2O3,GeO2,HfO2 ,Ho2O3,In2O3,ITO,Fe2O3,Fe3O4,La2O3,PbTiO3,PbZrO3,LiNbO3,Lu3Fe5O12,Lu2O3,MgO,MoO3,Nd2O3,Pr6O11,Pr(TiO2)2,Pr2O3,Sm2O3,Sc2O3,SiO2,SiO,SrTiO3,SrZrO3,Ta2O5,Tb4O7,TeO2,ThO2,Tm2O3,TiO2,TiO,Ti3O5,Ti2O3,SnO2,SnO,WO3,V2O5,YAG, Y3Al5O12,Yb2O3,Y2O3,ZnO,ZnO:Al,ZrO2(unstabilized),ZrO2-5-15wt%CaO) Selenides Sputtering Targets : Bi2Se3,CdSe,In2Se3,PbSe,MoSe2,NbSe2,TaSe2,WSe2,ZnSe Silicides Sputtering Targets : Cr3Si,CrSi2,CoSi2, HfSi2,MoSi2,NbSi2,TaSi2,Ta5Si3,TiSi2,Ti5Si3,WSi2,V3Si,VSi2,ZrSi2 Sulfides Sputtering Targets : Sb2S3 ,As2S3,CdS,FeS,PbS,MoS2,NbS1.75,TaS2,WS2,ZnS, Tellurides Sputtering Targets : CdTe,PbTe,MoTe2,NbTe2,TaTe2,WTe2,ZnTe Other : Cr-SiO ,GaAs , Ga-P, In-Sb , InAs, InP, InSn, other target show as below: superconducting thin film, protective film. Metal Sputtering Targets (include Rare Earth metal Sputtering Target): Al,Sb,Bi ,B ,Cd ,C,Ce ,Cr ,Co ,Cu ,Dy,Er,Eu,Gd,Ge ,Au ,C,Hf,Ho,In ,Ir ,Fe ,La,Lu ,Mg,Mn,Mo ,Nd,Ni,Nb,Pd,Pt ,Pr,Re ,Ru ,Sm,Se ,Sc,Ag,Si ,Ta,Tb,Tm,Sn,Ti,W,V ,Yb,Y,Zr,Zn,La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu , Sc, Y Alloy Sputtering Targets: AlCu,AlCr,AlMg,AlSi,AlSiCu, AlAg,AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd,CeSm,CrSi,CoCr, CoCrMo, CoFe,CoFeB,CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo ,CuGa,CuIn,CuNi,CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC,FeMn,GdFe, GdFeCo, HfFe,IrMn,IrRe,InSn,MoSi,NiAl,NiCr,NiCrSi,NdDyFeCo, NiFe,NiMn, NiNbTi ,NiTi,NiV,SmCo, AgCu,AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl,TiNi,TiCr,WRe ,WTi,WCu, ZrAl,ZrCu, ZrFe ,ZrNb,ZrNi,ZrTi,ZrY ,ZnAl,ZnMg Purity: 99%, 99.9%,99.95% 99.99%,99.995% 99.999% and 99.9999%. Shape: foil, sheet, rod, pipe, tube, ring, wafer, plate, tablet and base on your drawing. disk, rectangle, band, rod and other shapes Dimension: Diameter (
A960 Alumina offers consistently reliable and convincing performance even when subject to high thermal and electrical loads in terms of its: Thermocycling capability, Thermal shock resistance, Flexural strength, Surface quality, Thermal conductivity. This makes A960 Alumina Ceramic Substrates ideal for power electronics in conjunction with direct copper bonding (DCB) and active metal brazing (AMB). ALN Aluminum Nitride - with outstanding insulating properties and extremely high thermal conductivity (â?¥ 170 W/mK), Aluminum Nitride is perfect for the extremely high performance required in the electronics industry. AlN ceramic enables the compact, affordable construction of components and hybrid designs with high integration density. Extraordinary mechanical strength and a low thermal expansion coefficient enable seamless system integration.
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Alumina / Al2O3 is an excellent electrical insulator and one of the most widely used advanced ceramic materials. Additionally, it is extremely resistant to wear and corrosion. Alumina components are used in a wide range of applications such as electronics, pump components and automotive sensors. UNIPRETEC offers a variety of alumina compositions, including 92% Alumina, 95% Alumina, 96% Alumina, 99% Alumina, 99.5% Alumina and 99.8% Alumina. Boron Nitride / BN machinable ceramic is made by hot pressing Boron Nitride powders at high temperature and pressure. UNIPRETEC's Boron Nitride (BN) can easily be machined into rods, bars, plates and even intricate custom shapes.The unique combination of highly exceptional thermal, physical and chemical characteristics of BN Boron Nitride ceramic makes it ideal for solving tough challenges in a wide range of industrial applications. Silicon carbide / SiC, exceedingly hard, synthetically produced crystalline compound of silicon and carbon. Its chemical formula is SiC. Since the late 19th century silicon carbide has been an important material for sandpapers, grinding wheels, and cutting tools. More recently, it has found application in refractory linings and heating elements for industrial furnaces, in wear-resistant parts for pumps and rocket engines, and in semiconducting substrates for light-emitting diodes. Silicon Nitride / Si3N4 is a high performance ceramic that is extremely hard and has exceptional thermal shock and impact resistance. It surpasses most metals high temperature capabilities and has a superior combination of creep and oxidation resistance. Additionally, its low thermal conductivity and high wear resistance make it an excellent material that can withstand the toughest of conditions in the most demanding industrial applications.
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