Layer: 1-24 layer rigid pcb 1. Material Fr-4 (high tg 150c- 280c) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base 2. Surface finish: 1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold 2). Solder mask: lpi, green/red/blue/yellow/black 3). Silkscreen: white, yellow carbon lnk: available peelable mask: available 3. Board thickness: from min. 0.2mm to max. 6.0mm 4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz ) 5. Conductor width and spacing: min. 0.08mm 6. Drill hole: min. 0.2mm (8mil) 7. Tolerance: 1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth 2).Hole position: +/-0.025mm 3).Outline: +/-0.1mm 8. Pth wall thickness : 0.02mm 9. Min. S/m bridge: 0.12mil
Flexible pcbs are manufactured on a substrate of polyimide, and are free to bend, which Allows the installation of such boards in places, as well as use them as a flexible Connector. Flexible boards allow increased density mounting of electronic devices, Effectively using 3-d space. Basic materials: polyimide Thickness: 12.5 - 200 microns Surface finish: tin immersion and gold flash
Layer: 1-24 layer rigid pcb 1. Material Fr-4 (high tg 150ípc- 280ípc) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base 2. Surface finish: 1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold 2). Solder mask: lpi, green/red/blue/yellow/black 3). Silkscreen: white, yellow carbon lnk: available peelable mask: available 3. Board thickness: from min. 0.2mm to max. 6.0mm 4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz ) 5. Conductor width and spacing: min. 0.08mm 6. Drill hole: min. 0.2mm (8mil) 7. Tolerance: 1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth 2).Hole position: +/-0.025mm 3).Outline: +/-0.1mm 8. Pth wall thickness : 0.02mm 9. Min. S/m bridge: 0.12mil
Supplier: PCB (printed circuit board), FPC
Technical Capability: Product type FR4+FCCL(Flexible Copper Clad Laminate)rigid flex PCB Material FR4+FCCL Field of application military industrial Layers/thickness 4L/1.2mm Line Space/width 6/6mil Surface treatment ENIG Minimum hole dia. 0.2mm Technical feature special material,rigid-flex technology
We OffeCircuit Boardr a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs Process Item Craft Capacity Prepares materials Base Material FR4, CEM-1, Aluminium, High Tg Material, Halogen-free Material Lamination press Layer Count 1-12Layers Thickness 0.2-3.0mm Drill Min.Hole Diameter 0.15mm (mechanical drill), 0.1MM (laser drill) PTH Diameter Tolerance + / - 3mil NPTH Diameter Tolerance + / - 2mil Outer layer Min.Line/Space 3.5mil/3.5mil Copper Thickness 1- 6oz Impendence Impedance tolerance ±10% (±5%(Need assessment) Solder Masking Min.Solder Dam 0.1mm Min.Solder Mask Opening 0.075mm Color Green, White, Red, Yellow, Black, Blue Surface Treatment LF-HASL, OSP,Ni/Au Enig,Immersion Tin, Immersion Silver, carbon oil; Out-Line Profiling Profile Tolerance + / - 0.12MM V-cut Remain Thickness Tolerance + / - 0.1MM V-cut Angle Tolerance + / - 5° Testing E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing Final Product Thickness Tolerance + / - 10% Warpage Tolerance + / - 0.75% Lead Time Double layer PCB Multilayer PCB Mass production Normal 6 work days Normal 8 work days Double layer 9-12 work days Urgent 3 work days Urgent 6 work days Multilayer 12-15 work days Email:sales5@(keyoupcb.com) Learn more from our website:www.keyoucircuit.com ADD:Room K221,jinhetian Center,QINGHU AREA,SHENZHEN, Guangdong,China
Supplier: PCB(Printed circuit board) FPC, and PCBA
PCBA Capability Capability - SMT Lines 9 (5 Yamaha, 4 KME) Capacity 52 million placements per month Max Board Size 457 X 356mm. (18 x 14) Min Component size 0201 54 sq. mm. (0.084 sq. inch), long connector, CSP, BGA, QFP Speed 0.15 sec/chip, 0.7 sec/QFP Capability - PTH Insertion Type # of Lines Capacity (points/mth) Max Board Size Lead Pitch Jumper Wire 3 6 million 330X250 mm (13 x 9.8) 5-30 mm Axial 3 6 million 457x559 mm (18 x 22) 5-20 mm Radial 3 9 million 457x559 mm (18 x 22) 0.36-21.5 mm Wave Soldering Wave Soldering 2 Max board width 400 mm Type Dual wave Pbs Status Lead-free line support Max temp 399 degree C Spray flux add-on Pre-heat zones 3
Layer: 1 to 16 layers Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX Board thickness: 0.20mm to 3.4mm copper thickness: 0.5 OZ to 6 OZ copper thickness in hole: >25.0 um(>1mil) Max size of finish board: 700*460mm Min.Drilled Hole Size: 1.0mm Min.Line Width: 3mil Min.Line Spacing: 3mil Surface finishing: HASL/HASL lead free,HAL,Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating Solder Mask Color: Green/Yellow/Black/White/Red/Blue Shape tolerance: ±4mil Hole tolerance: PTH:±3mil,NPTH:±2mil Package: Inner paking/Plastic bag,Outer packing:Standard carton packing Certificate: UL,SGS, ISO 9001:2008,IATF16949 Special requirements: Buried and blind vias+controlled impedance+BGA Profiling: Punching,Routing, V-CUT,Beveling
