Board thickness: 0.2mm-6.0mm Laminate: fr-4, taconic, rogers, tg170, tg180, cem-1 Layers: single side, double side, multilayer Outer / inner coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz. Multilayer stack up: stack up, controlled impedence. Pcb size: unit size, panel size, tooling strips, tooling holes and fudicials. Min hole size: 0.2mm (shape tolerance¡à 0.13mm, hole tolerance: pth¡à 0.075mm; npth: ¡à 0.05mm) Min line width: 0.1mm Min line spacing: 0.1mm Solder mask color: green, blue, red, black, yellow, white Legend color: white, yellow, black, blue, red Surface finished: hal(tin / lead), hal(lead free), immersion gold, immersion silver, Immersion tin, gold plated(soft gold), osp(entek). Certificate: rohs, sgs, ukas, iso14001, dnv, ul Profiling: cnc, routing, punching, beveling, v-cut, v-score, counter sink. Test: e-test, fixture, fly-test. Special technique: buried and blind vias, controlled impedance, bga. We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Package: vacuum package
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1 2. Application : Industrial Equipment 3. Thickness : 0.5T 4. Machine Drill : Min. 0.25 mm 5. Laser Drill : BVH Min. 0.12 mm 6. Cu Plating : HOLE Min. 25 micrometer 7. L/S : 110 micrometer/ 120 micrometer
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added
Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material Key specifications/special features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch fr4 New fr4 technology from photo circuit New thermally conductive adhesive technology Suitable for body through power train controller application Standard export carton
Material: pi, pet, pc Production category: single side fpc, double side fpc, multilayer fpc, aluminum base board, copper base board Surface finishing: ni/au plating, immersion tin/gold, pure-tin plating Standard: rohs, sgs, ukas, iso14001, dnv, ul Stiffener: fr4, pi, pet Solder mask color: green/yellow/black/white/red/blue Export area: global The capacity of double-sided board: 60000 sq m/year The capacity of multilayer board: 100000 sq m/year We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing
2 layer with 10 oz / 350um copper Material: fr4 (tg 135'c) Finished thickness: 1.6mm Finished copper: 10 /10 oz Min hole size: 2.0 mm Without solder mask. Surface: osp
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
FPC PCB flexible printed circuit board
Multilayer pcbs Major material: fr-4, nelco, htg>170, high cti value, halogen free Minimum board thickness: Double sided: 0.2mm Multilayer: 0.4mm Maximum board thickness: Double sided: 2.4mm Multilayer: 3.2mm Surface finishing: Hal Lead-free hal Flash gold Selective gold Immersion gold (enig) Immersion tin Immersion silver Carbon print Gold fingers Entek (osp) Flux coating Peelable mask Gold plating (hard gold) Enig thick gold Solder mask plugged hole Copper finished thickness: 1/2 oz to 6 oz Minimum hole size: 0.25mm Minimum line width/spacing: 0.1 Standard: rohs, sgs, ukas, iso14001, dnv, ul We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing
