Item: Diamond wire Shape:wire Material: Imported C-steel Diameter:55μm-450μm available Advantage of Diamond cutting wire saw for solar silicon wafer The breaking strength of diamond wire is high and stable; the diamond particles is well distributed and and no agglomeration, to keep the diameter of diamond wire uniform withdifferent diamond density; strongbonding force of plating ,and there's no peeling and cracks; the coating is compact and smooth, the appearance looks silver andbeautiful. INTRODUCTION: 24 years of history in steel wire transforming and coating Listed on Shenzhen A stock market in 2007 An annual output of 3000000 Kilometers of sawing wire ISO/TS 16949 And ISO9002 certificated http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com