Descriptions: Thermal Conductive Thermal Phase Change Interface Material is a new type of sheet made of a non-silicone-based phase change material. These sheets change phase in response to heat. The heat generated by a CPU or other devices causes the sheet to change from a solid to a fluid phase, resulting in lower thermal resistance superior heat dissipation. Features: High thermal conductivity. Excellent thermal transfer properties, easy to use. Heating applying pressure further thins the sheet, resulting in extremely low thermal resistance. Exhibits stable thermal properties over long-term use. Applications: Not to be used in case where electrical insulation is required, mainly used in heating devices, such as: the computer industry, integrated circuit market, mobile phone industry, network, communication equipment, automotive electronics, LED lighting, aerospace.