General specification for flexible & rigid-flex printed circuit board Layer count: 1-6l(flex) & 2-10l(rigid-flex) Board thickness: 0.05-3.0mm Base polyimide film thickness: 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ). Copper thickness: 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ) Stiffeners: polyimide, fr4, metal Min trace width/spacing: 3/3mil(0.075/0.075mm) Min drill size: 0.2mm Surface treatment: immersion gold/tin, gold/tin plating, osp Vacuum package
