Layer: 1-24 layer rigid pcb 1. Material Fr-4 (high tg 150ípc- 280ípc) , fr-1, fr-2, cem-1, cem-3, rogers, halogen free, aluminium base 2. Surface finish: 1). Hal, hal lead free, osp ( entek ), immersion gold, immersion tin/silver, flash gold 2). Solder mask: lpi, green/red/blue/yellow/black 3). Silkscreen: white, yellow carbon lnk: available peelable mask: available 3. Board thickness: from min. 0.2mm to max. 6.0mm 4. Copper thickness: 18um ( 0.5 oz )---175um ( 4 oz ) 5. Conductor width and spacing: min. 0.08mm 6. Drill hole: min. 0.2mm (8mil) 7. Tolerance: 1).Hole diameter: +/-0.05mm for pth, +/-0.025mm for npth 2).Hole position: +/-0.025mm 3).Outline: +/-0.1mm 8. Pth wall thickness : 0.02mm 9. Min. S/m bridge: 0.12mil