Brief Introductions: Type: 6A2 Bond: Resin Application: Semiconductor Industry, Silicon Ingot, Cylindrical Grinding/ OD Grinding Specification: Customized Trade Terms: FOB Packages: Hard carton Delivery Time: 15 workdays by express Resin Grinding Wheel Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat. Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs). D (mm) T (mm) H (mm) W (mm) X (mm) Materials 100 28 31.75 3, 5, 6, 9 3-8 Silicon, sapphire, and gallium arsenide (GaAs) 200 35, 50, 60 76, 80 3, 5, 6, 9 300 20, 30, 35 127 5, 7 350 40 5, 7 Rough / Fine grinding (100 1000#) Other specifications can be custom according to the requirement Advantages of Resin Grinding Wheel Realizes a total-like cost cut by fast material removal Minimal influence on crystalline structure Low grinding load, good grinding performance and wear resistance Ingot surface with a high flat degree. Low dressing frequency Service: Detailed Specifications can be customized! Provide after-sales service Technical support on usage Return and exchange of products for non-human reasons