Brief Introductions:

Type: 6A2
Bond: Resin
Application: Semiconductor Industry, Silicon Ingot, Cylindrical Grinding/ OD Grinding
Specification: Customized
Trade Terms: FOB
Packages: Hard carton
Delivery Time: 15 workdays by express


Resin Grinding Wheel
Peripheral grinding of silicon ingots, or processing the outer surface of silicon ingots and to make orientation flat.
Materials used in semiconductors and electronics parts, automobiles and photovoltaic industry. Types of these materials are varied including silicon, sapphire, and gallium arsenide (GaAs).
D (mm) T (mm) H (mm) W (mm) X (mm) Materials
100 28 31.75 3, 5, 6, 9 3-8 Silicon, sapphire, and gallium arsenide (GaAs)
200 35, 50, 60 76, 80 3, 5, 6, 9
300 20, 30, 35 127 5, 7
350 40 5, 7
Rough / Fine grinding (100 1000#)
Other specifications can be custom according to the requirement

Advantages of Resin Grinding Wheel
Realizes a total-like cost cut by fast material removal
Minimal influence on crystalline structure
Low grinding load, good grinding performance and wear resistance
Ingot surface with a high flat degree.
Low dressing frequency

Service:
Detailed Specifications can be customized!
Provide after-sales service
Technical support on usage
Return and exchange of products for non-human reasons