1. Main applications are for protection,carrier use. 2. Provides enough holding adhesion during dicing operation at regular temperature, objects are not moved, nor flying. Easily released after heating. 3. Single sided or double sided. 4. Thermal release temperature: 95ºC,120ºC,150ºC,180ºC . 5. For:Wafer Dicing,Chip Dicing, MLCC Dicing,LED or Semiconductor Industry Wafer, Chip Dicing.