Thermall pad can solve the problem of product structural design tolerances and can be reused. It is a excellent vertical heat conduction material between the heat source (CPU or electronic chipset) and the heat sink instruments. Easy to use and rework. Testing items Testing standard WT 5912 Series WT 5902 Series Appearance Visual Gray-pink/Green/Blue Grey Orange/Pink/Grey Thermal conductivity(W/M.K)ASTM D54701.0~3.0 4.0~8.0 Thickness(mm) ASTM D374 0.2~8.0 0.5~8.0 Hardness(Shore OO) ASTM D2240 25~60 35~65 Density (g/cc) ASTM D792 1.8~3.2 3.3~3.5 Breakdown stength(kV/mm)ASTM D149 8.0 8.0 Volume resistivity((-cm) ASTM D257 1.01011 1.01011 Temp. range() NA -50~200 -50~200 Flame retardancy UL94 V-0 V-0