We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: · Rigid boards up to 42 layers · Flex and Rigid-Flex boards up to 40 layers · Hybrid solutions for Microwave/RF applications · Thermal and signal integrity management solutions, employing coins and cavities · 2D or 3D heat-sinks: Copper and Aluminum · Carbon printing · HDI blind, buried, staggered & stacked vias · Buried passive components: capacitors and resistors · In-house HATS lab