High precision dicing Improved cut quality on hard materials Superior cut quality Good wear resistance PRODUCT DETAILS Description: Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed. Application: Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN ï¼?copper epoxy molding ), splitter, sapphire. Advantages: 1.High precision dicing 2.Improved cut quality on hard materials 3.Superior cut quality 4.Good wear resistance